Assembly

                                       

Fine Pitch Assembly for 0201 chips, BGA’s, Micro-BGA’s, QFN’s, etc.Fine Pitch Assembly for 0201 chips, BGA’s, Micro-BGA’s, QFN’s, etc.

Our pick’n place machine handles 14,400 cph

Our pick’n place machine handles 14,400 cph

 

MyData MY9 machine handles 14,400 cph

 


Screen Printing machine DEK248 which utilizes the DEK align 4-

position system which allows a high level of accuracy even with
fine pitch or problem boards.

 

Pick’n Place machine will exam parts “on-the-fly”.

Pick’n Place machine will exam parts 'on-the-fly'.

 

Inventory handled by MRP system

Inventory handled by MRP system

 

Heller Oven with 9 heating zones and 2 cooling zones


Stencil storage to prevent any damage to your stencils.Stencil storage

 

Wave Solder machine ECONO PAK+

 

Automatic Lead Trimmer